184 .4mm pitch qfp results

Laser Solder Reflow: A Process Solution, Part 2

Micro-Sectioning of PCBs for Failure Analysis

SMTnet Express - July 15, 2021

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

SMTnet Express - October 16, 2014

Semiconductor *Long-term storage of BGA & QFP produ

SMTnet Express - August 10, 2017

SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass

SMTnet Express - January 18, 2018

SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip

SMTnet Express - April 30, 2020

SMTnet Express, April 30, 2020, Subscribers: 36,108, Companies: 10,995, Users: 25,780 Selective Solder Fine Pitch Components On High Thermal Mass Assembly Credits: ITW EAE The number of through-hole components on PCBs has declined significantly

Assembly Process Variables Voiding At A Thermal Interface

Design Environment ROI: How Design Teams On A Budget Can Build A Best In Class Design Environment