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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

0201 and 01005 Adoption in Industry

0201 and 01005 Adoption in Industry 0201 and 01005 Adoption in Industry First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts

SMT Express, Volume 4, Issue No. 9 - from SMTnet.com

SMTnet Express - April 21, 2022

Apex

IPC Printed Circuits Expo APEX

SMTnet Express - September 28, 2017

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Whizz Systems

Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.

Manufacturer / Consultant / Service Provider

3240 Scott Blvd
Santa Clara, CA USA

Phone: +1 408 980 0400