374 0402 pad to pad spacing results

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

The Environmental Cost of Green

SMT Express, Volume 4, Issue No. 9 - from SMTnet.com

Conforming To a Higher Standard of Reliability

Conforming To a Higher Standard of Reliability

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMT Express, Volume 5, Issue No. 1 - from SMTnet.com

Reworking QFN's Newly Developed Cost Effective Approach

smeared solder paste pattern. A typical pad size for

Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique

Conductive Adhesives: The Way Forward