Express Newsletter: 0402 solder thickness (Page 7 of 99)

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

boards soldered with no-clean and lead-free flux tec

SMTnet Express - November 6, 2014

SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald


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