SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
SMTnet Express, October 1, 2015, Subscribers: 23,533, Members: Companies: 14,674, Users: 39,065 Printing of Solder Paste - A Quality Assurance Methodology Lars Bruno, Tord Johnson; Ericsson AB and MTEK Consulting AB Solder paste printing
SMTnet Express, September 17, 2015, Subscribers: 23,487, Members: Companies: 14,646, Users: 38,975 Method for the Manufacture of an Aluminum Substrate PCB and its Advantages Joseph Fjelstad; Verdant Electronics RoHS legislated restrictions
SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
SMTnet Express, August 20, 2015, Subscribers: 23,363, Members: Companies: 14,574, Users: 38,793 Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly John McMahon P.Eng, Tom Blaszczyk, Peter Barber; Celestica Corporation
SMTnet Express, August 6, 2015, Subscribers: 23,145, Members: Companies: 14,536, Users: 38,702 Enclosed Media Printing as an Alternative to Metal Blades Michael L. Martel; Speedline Technologies, Inc. Fine pitch/fine feature solder paste printing
SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State
SMTnet Express, October 29, 2015, Subscribers: 23,683, Members: Companies: 14,724, Users: 39,236 Novel Approaches for Minimizing Pad Cratering Chen Xu, Yunhu Lin; Alcatel-Lucent, Yuan Zeng, Pericles A. Kondos; Unovis-Solutions.; Alcatel
SMTnet Express, October 15, 2015, Subscribers: 23,684, Members: Companies: 14,684, Users: 39,145 Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
