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Express Newsletter: 2113 cost (Page 18 of 40)
A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE
Application Of Build-in Self Test In Functional Test Of DSL
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
New Developments in PCB Laminates
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
Pad Cratering - The Invisible Threat to the Electronics Industry
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
A Look to the Future in the Electronics Industry at IPC APEX EXPO� 2013
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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