Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Effect Of Squeegee Blade On Solder Paste Print Quality Effect Of Squeegee Blade On Solder Paste Print Quality The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount
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