SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
,Texas Instruments Inc., Dallas, TX ABSTRACT Minor voiding in
, M. Anselm; Universal Instruments Corporation .
.jpg)
