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SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Machine Capability Measurement on SMT Equipment by Romain Schmitt, Jean Marie Guillet - Solectron
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Machine Capability Measurement on SMT Equipment by Romain Schmitt, Jean Marie Guillet - Solectron Technology, Inc. Abstract
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
America, especially Sn3.0Ag0.5Cu (SAC305), the
