Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
SMTnet Express, June 11, 2020, Subscribers: 28,786, Companies: 11,016, Users: 25,863 Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine Interfaces Credits: Georgia Institute of Technology Recent