Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
RF Packaging Advancements RF Packaging Advancements EMPF / ACI Credit/Source: Fred Verdi The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share
SMTnet Express, March 5, 2015, Subscribers: 22,464, Members: Companies: 14,248, Users: 37,833 Conformal Coating over No Clean Flux Residues K.Seelig, T.O'Neill; AIM Solder As the proliferation of modern day electronics continues to drive
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 82, (#ts#)) SMT Express, Volume 3, Issue No. 11 - from SMTnet.com Volume 3, Issue No. 11 Tuesday, November 20, 2001
A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
2747 Loker Ave. West
Carlsbad, CA USA
Phone: 760-431-1919
