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Improvement of Organic Packaging Thermal Cycle Performance Measurement

Improvement of Organic Packaging Thermal Cycle Performance Measurement  Featured Article Improvement of Organic Packaging Thermal Cycle Performance Measurement Endicott Interconnect Technologies Glenn O. Dearing, Paul J. Hart Flip Chip Plastic

SMTnet Express - August 13, 2015

SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic


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