347 adhesive film results

SMT Express, Volume 2, Issue No. 12 - from SMTnet.com

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

SMTnet Express - September 10, 2020

SMTnet Express - November 22, 2017

SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper

SMTnet Express July 18 - 2013, Subscribers: 26169

Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique

Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly

SMT Express, Volume 4, Issue No. 10 - from SMTnet.com

SMT Express, Volume 2, Issue No. 11 - from SMTnet.com

SMTnet Express August 1 - 2013, Subscribers: 26182

SMTnet Express August 15 - 2013, Subscribers: 26214