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Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Endicott Interconnect Technologies Credit/Source: Michael J. Rowlands, Rabindra Das More and more
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SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip
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