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Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

SMT Express, Volume 3, Issue No. 11 - from SMTnet.com

SMTnet Express - July 27, 2017

SMTnet Express - December 29, 2016

SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester

SMTnet Express - May 18, 2017

SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires

SMTnet Express - July 20, 2017

SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528 Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation , Mike

IPC Printed Circuits Expo APEX

Evaluating Soldering Irons for Lead Free Assembly

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Level Kester, Inc. Credit/Source: Peter Biocca, C

Optimizing Flip Chip Substrate Layout for Assembly