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A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Reflow Profiling: Time Above Liquidus

Placement Optimisation in a Lean Manufacturing Environment

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Embedded Thermoelectric Cooling Article

High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)

Conductive Adhesives: The Way Forward

SMT Express, Volume 2, Issue No. 8 - from SMTnet.com

SMTnet Express - July 7, 2016

SMTnet Express, July 7, 2016, Subscribers: 25,539, Companies: 14,860, Users: 40,631 Dissolution of Metal Foils in Common Beverages Bev Christian, Nancy Wang, Mark Pritzker, Daniella Gillanders, Gyubok Baik, Weiyi Zhang, Joanna Litingtun, Brian Kim

IPC Printed Circuits Expo APEX