Express Newsletter: aluminum wedge bonding (Page 2 of 15)

SMTnet Express - August 31, 2017

SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry

Economical aluminum substrates make light work of visible LED circuits…

Economical aluminum substrates make light work of visible LED circuits… News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Economical Aluminum Substrates Make Light Work

Economical aluminum substrates make light work of visible LED circuits…

Economical aluminum substrates make light work of visible LED circuits… News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Economical Aluminum Substrates Make Light Work

SMTnet Express - September 24, 2015

SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad

SMTnet Express - September 17, 2015

SMTnet Express, September 17, 2015, Subscribers: 23,487, Members: Companies: 14,646, Users: 38,975 Method for the Manufacture of an Aluminum Substrate PCB and its Advantages Joseph Fjelstad; Verdant Electronics RoHS legislated restrictions

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale


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