146 aluminum wedge bonding results

Minimizing Voiding In QFN Packages Using Solder Preforms

SMTnet Express March 14 - 2013, Subscribers: 26245

HALT Testing of Backward Soldered BGAs on a Military Product

-Pillar and BOT (Direct Bond on Substrate-Trace) Us

HALT Testing of Backward Soldered BGAs on a Military Product

-Pillar and BOT (Direct Bond on Substrate-Trace) Us

SMTnet Express - December 10, 2015

SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP Myung-June Lee

SMTnet Express - November 17, 2016

SMTnet Express - April 11, 2019

SMTnet Express - January 8, 2020

SMTnet Express - September 10, 2020

SMTnet Express - Octomer 1, 2020