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High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

Alternative Pb-Free Alloys

Alternative Pb-Free Alloys Alternative Pb-Free Alloys While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about

IPC Printed Circuits Expo APEX

IPC Printed Circuits Expo APEX

SMT Express, Volume 4, Issue No. 1 - from SMTnet.com

SMT Express, Volume 4, Issue No. 7 - from SMTnet.com

SMT Express, Volume 5, Issue No. 1 - from SMTnet.com

SMT Express, Volume 4, Issue No. 9 - from SMTnet.com

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder News   Forums   SMT Equipment   Company Directory Calendar   Career Center   Advertising   About   FREE Company Listing! Controlling Copper Build Up