SMTnet Express, October 30, 2014, Subscribers: 23456, Members: Companies: 14075, Users: 37030 Solder Joint Reliability Under Realistic Service Conditions. P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Binghamton University, M. Meilunas
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
SMTnet Express, October 2, 2014, Subscribers: 23352, Members: Companies: 14077, Users: 36923 Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials Jennifer Nguyen Ranilo Aranda, David Geiger, and Murad Kurwa; Flextronics
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald
SMTnet Express, November 28, 2014, Subscribers: 23553, Members: Companies: 14124, Users: 37254 Preparation, Manufacturing Lead-Free Soldering Alloy Tarik Talib Issa, Asmaa Shawky Khalil - University of Baghdad . A soldering alloy
SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
