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New BGA Solder Mask Repair Technique Using Laser Cut Stencils

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Design Environment ROI: How Design Teams On A Budget Can Build A Best In Class Design Environment

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First Principles of Solder Reflow

Large Thin Organic PTFE Substrates for Multichip Applications

High Reliability Test Products

Reflow Profiling: Time Above Liquidus

Lead-Free BGA Rework-Transition

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Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Flux Collection and Self-Clean Technique in Reflow Applications

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills