Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
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SMTnet Express, November 23, 2021, Subscribers: 26,441, Companies: 11,466, Users: 26,939 Automated Optical Inspection Method for Light-Emitting Diode Defect Detection Using Unsupervised Generative Adversarial Neural Network Many