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SMTnet Express - December 2, 2021

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

SMTnet Express - January 17, 2019

SMTnet Express, January 17, 2019, Subscribers: 31,198, Members: Companies: 10,693, Users: 31,603 IPC APEX EXPO 2019 - TECHNOLOGY'S FUTURE COMES TOGETHER Why Attend IPC APEX EXPO 2019? Because IPC APEX EXPO

Novel Probing Concepts for Mass-Production Tests: Design and Challenges

published in the 2012 IPC APEX EXPO technical conference p

Thermal Characteristics of PCB Laminates used in High Frequency Applications

published in the 2012 IPC APEX EXPO technical con

New Developments in PCB Laminates

New Developments in PCB Laminates Online Version SMTnet Express July 19, 2012, Subscribers: 25329, Members: Companies: 8927, Users: 33365 New Developments in PCB Laminates First published in the 2012 IPC APEX EXPO technical conference proceedings

SMTnet Express - December 12, 2019

SMTnet Express, December 12, 2019, Subscribers: 33,007, Companies: 10,941, Users: 25,408 IPC APEX EXPO 2020 – Celebrating 20 Years of Excellence in Electronics This year marks the 20th anniversary of IPC APEX EXPO and IPC is thrilled

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

SMT Express