485 apex san diego results

Scaling LCA with IPC-175x

Scaling LCA with IPC-175x SMTnet Express June 8, 2012, Subscribers: 25249, Members: Companies: 8892, Users: 33210 Scaling LCA with IPC-175x First published in the 2012 IPC APEX EXPO technical conference proceedings. by: Jørgen Vos, Industry

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

An Investigation of Whisker Growth on Tin Coated Wire and Braid

IPC APEX EXPO technical conference proceedings.

Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments

First published in the 2012 IPC APEX EXPO technical co

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

in the 2012 IPC APEX EXPO technical conference procee

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Pad Cratering - The Invisible Threat to the Electronics Industry

in the 2012 IPC APEX EXPO technical conference proceedings.

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

Circuit Boards First published in the 2012 IPC APEX EXP

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

Pd-Layers First published in the 2012 IPC APEX EXP