Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
SMT Express, Volume 2, Issue No. 8 - from SMTnet.com Volume 2, Issue No. 8 Wednesday, August 16, 2000 Special Announcements SMTnet's OnBoard Forumto Feature Dr. Ning-Cheng Lee August 22, 2000 8:00 AM ET to August 24, 2000 5:00 PM ET So just