954 at-707 - bga / csp reflow & re results

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

Processing and Troubleshooting SMT, BGA, CSP and Flip Chip

SMTnet Express - February 4, 2016

SMT Express, Volume 3, Issue No. 3 - from SMTnet.com

SMT Express, Special Edition, Issue 1 - from SMTnet.com

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

SMT Express

SMTnet Express - March 06, 2014

SMT Express, Volume 4, Issue No. 9 - from SMTnet.com

SMTnet Express - April 17, 2014

SMTnet Express - January 5, 2014

SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins