SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
Supply Chain Security: DFARS - Detection & Avoidance of Counterfeit Electronic Parts Online Version SMTnet Express, September 20, 2018, Subscribers: 31,325, Companies: 11,050, Users: 25,207 Supply Chain Security: DFARS - Detection & Avoidance
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
