SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
SMTnet Express, November 28, 2014, Subscribers: 23553, Members: Companies: 14124, Users: 37254 Preparation, Manufacturing Lead-Free Soldering Alloy Tarik Talib Issa, Asmaa Shawky Khalil - University of Baghdad . A soldering alloy
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
SMTnet Express, March 22, 2018, Subscribers: 30,947, Companies: 10,909, Users: 24,534 Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing Tom Watson; Kimball Electronics, Inc. Solder paste printing is the first step
