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Thermal Characteristics of PCB Laminates used in High Frequency Applications SMTnet Express July 11, 2012, Subscribers: 25312, Members: Companies: 8920, Users: 33335 Thermal Characteristics of PCB Laminates used in High Frequency Applications First

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

SMT Express, Volume 4, Issue No. 3 - from SMTnet.com

3D ICs With TSVs - Design Challenges And Requirements

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

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Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

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