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Express Newsletter: belt glue (Page 1 of 19)
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Selective Solder Paste Deposition Reliability Test Results
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)
Five Myths of Reliability
Five Myths of Reliability
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections
Cleaning High-power Electronics
Cleaning High-power Electronics
Drop Shock Reliability of Lead-Free Alloys Effect of Micro-Additives
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IPC Certification Training from the comfort of your home or office. See our 2024 Training schedule now.
TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.
Reflow Soldering 101 Training Course
Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
High Throughput Reflow Oven
Imagineering specializes in quick turn PCB's and Assemblies. ITAR Registered and AS9100 certified.
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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