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SMTnet Express July 11 - 2013, Subscribers: 26149

SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute

The Call for Halogen-Free Electronic Assemblies

Void Detection in Large Solder Joints of Integrated Power Electronics

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMTnet Express - March 22, 2018

SMT Manufacturability and Reliability in PCB Cavities

Implementation challenges for PCB tracking using RFID

Implementation challenges for PCB tracking using RFID

Productronica 2007 Special Show Report

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure