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SMTnet Express, March 4, 2021, Subscribers: 27,552, Companies: 11,300, Users: 26,506 Every day, thousands of engineers visit SMTnet Searching for answers to their production equipment repair / replacement needs ... Right now
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
