SMTnet Express, January 30, 2020, Subscribers: 33,757, Companies: 10,967, Users: 25,554 Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Credits: Heller Industries Inc. This paper explores new advances
the defect rate of the measured machine. For exampl
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
(Flex) BGA Using a Polyimide Tape Substrate Trent
IPC is the trade association for the printed wiring board and electronics assembly industries.
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