Express Newsletter: bga crack ict test jig damage (Page 1 of 94)

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Lead-Free BGA Rework-Transition

Lead-Free BGA Rework-Transition News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-Free BGA Rework-Transition Issues. Determining which assemblies are lead free

Boundary Scan

Boundary Scan News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Boundary Scan Skews Test Coverage Tradeoffs in your Favor ASSET InterTech, Inc. Credit/Source: Dominic

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I.C.T ( Dongguan ICT Technology Co., Ltd. )
I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Manufacturer

I.C.T Industrial Park, Building 1
Dongguan, 30 China

Phone: +86 13670124230

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