473 bga glue results

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Selective Solder Paste Deposition Reliability Test Results

SMTnet Express - September 12, 2019

Sustaining a Robust Fine Feature Printing Process

Aiming for High First-pass Yields in a Lead-free Environment

SMTnet Express April 11 - 2013, Subscribers: 26336

SMTnet Express September 12 - 2013, Subscribers: 26270

BGA Package Component Reliability After Long-Term Storage

BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension

Five Myths of Reliability