986 bga socket soldering results

Building Differentiated Products Through Shorter, More Predictable Design Cycles

index.cfm

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMTnet Express - December 5, 2019

SMTnet Express, December 5, 2019, Subscribers: 32,833, Companies: 10,936, Users: 25,393 Masking for Conformal Coatings Credits: ACI Technologies, Inc. Conformal coatings are regularly employed to protect the surface of a soldered printed circuit

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder

Implementation challenges for PCB tracking using RFID

Implementation challenges for PCB tracking using RFID

SMT Express, Volume 3, Issue No. 10 - from SMTnet.com

Optimizing the Clean-Tech Manufacturing Mix

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution