499 bga sockets moisture results

Organic Flip Chip Packages for Use in Military and Aerospace Applications

A New (Better) Approach to Tin Whisker Mitigation

Reworking QFN's Newly Developed Cost Effective Approach

Building Differentiated Products Through Shorter, More Predictable Design Cycles

Building Differentiated Products Through Shorter, More Predictable Design Cycles

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

index.cfm

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall

SMT Express, Volume VI, Issue No. I - from SMTnet.com