Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
malfunctions in high-power electronics, flux residue
malfunctions in high-power electronics, flux residue