1005 biocca senior development engineer kester results

Developing a Reliable Lead-free SMT Assembly Process

Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Level Kester, Inc. Credit/Source: Peter Biocca, C

The Proximity of Microvias to PTHs And Its Impact On The Reliability

SMTnet Express - July 27, 2017

SMTnet Express - July 20, 2017

SMTnet Express, July 20, 2017, Subscribers: 30,612, Companies: 10,637, Users: 23,528 Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation , Mike

SMTnet Express - December 29, 2016

SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester