SMTnet Express, January 21, 2016, Subscribers: 24,035, Members: Companies: 14,931, Users: 39,786 Dispelling the Black Magic of Solder Paste Tony Lentz; FCT Assembly Solder paste has long been viewed as "black magic". This "black magic" can easily
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
Horizontal Convection Reflow Technology Defined Horizontal Convection Reflow Technology Defined Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct
Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University