1034 board stop too soon results

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SMT Express, Volume 3, Issue No. 8 - from SMTnet.com

SMT Express, Volume 3, Issue No. 8 - from SMTnet.com Volume 3, Issue No. 8 Thursday, August 16, 2001 OnBoard Forum SMTnet's OnBoard Forum to Feature Jeff Schake September 17, 2001 8:00 AM EST to September 21, 2001 5:00 PM EST Jeff

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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

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