Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
-세계 최고 품질의 대류열풍방식으로 새로운 표준을 선도하는 HELLER Reflow Oven -10년 연속 World Wide Market Share 1위와 2014 SERVICE EXCELLENCE AWARDS 수상
459-1 Jangji-Dong, Kwangju-Si
Kyungki-Do, 13 South Korea
Phone: +82-31-769-0808
.gif)
