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High Reliability Test Products
Printed Circuit Board Failure Analysis
Breakthrough in Molecular Design
Air Powered Dispensing
Lead-Free Wave Soldering
Implementing Lead Free Soldering European Consortium Research
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
SMTnet Express - December 9, 2021
PTH - Reliability from Chip Carriers to Thick Printed Wiring Boards
SMTnet Express - November 23, 2021
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Stencil Printing 101 Training Course
Wave Soldering 101 Training Course
Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Training online, at your facility, or at one of our worldwide training centers"
Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Lewis and Clark, Inc. is the #1 provider of pre-owned Surface Mount and In-Circuit Test equipment.
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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