Method of Modeling Differential Vias Method of Modeling Differential Vias Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high
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---> SMT Express, Volume 3, Issue No. 6 - from SMTnet.com Volume 3, Issue No. 6 Friday, June 15, 2001 Featured Article Return to Front Page PCB Assembly Techniques by Harvey Twyman , University of Kent at Canterbury "I'm sure you
SCAVENGING Scavenging Scavenging, Site Dressing, Residual Solder Removal. What's in a name? "That which we call an onion, by any other name would smell as strong" (apologies to the immortal bard). And, regardless of the name you give it
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Positive Outlook from Exhibitors at IPC Midwest 2009 Positive Outlook from Exhibitors at IPC Midwest 2009 The recent IPC Midwest Conference & Exhibition in Schaumburg, IL was a small but important showcase of companies in the SMT
. This can result in serious and costly problems t
Effect Of Squeegee Blade On Solder Paste Print Quality Effect Of Squeegee Blade On Solder Paste Print Quality The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount
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SMTnet Express, August 5, 2021, Subscribers: 26,838, Companies: 11,415, Users: 26,785 An Intelligent Approach For Improving Printed Circuit Board Assembly Process Performance In Smart Manufacturing The process of printed circuit
