Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
SMTnet Express, December 10, 2020, Subscribers: 27,890, Companies: 11,201, Users: 26,310 Of the 88,000 engineers that visit SMTnet every month, over 87% arrive from using a Search engine … • ~13,600,000 pages that relate to "automated
SMTnet Express February 22, 2013, Subscribers: 26196, Members: Companies: 13298, Users: 34342 Bringing Rapid Prototyping In-House Day to day, year over year, businesses are forced to make critical R.O.I. related decisions that impact the future
of USB-C chargers and hubs in automotive a
IPC APEX EXPO Surges In San Diego IPC APEX EXPO Surges In San Diego The electronic interconnect industry came together at IPC APEX EXPO® in San Diego, with the show reporting a 26 percent increase in attendance over 2011 with 4
