SMTnet Express, October 24, 2013, Subscribers: 26339, Members: Companies: 13466, Users: 35314 Effect of Reflow Profile on Intermetallic Compound Formation by I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza; Universiti Teknologi
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A High Performance and Cost Effective Molded Array Package Substrate A High Performance and Cost Effective Molded Array Package Substrate In this article we present both a relatively new and innovative family of packages that is suitable
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