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Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

Lean, Mean Dual-Lane Machines

Developing a Reliable Lead-free SMT Assembly Process

Selective Soldering Process

Optimizing Thermal & Mechanical Performance in PCBs

Placement Optimisation in a Lean Manufacturing Environment

Fundamentals of Solder Paste Technology

Comparing techniques for temperature-dependent warpage measurement

Embedded Thermoelectric Cooling Article

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