SMTnet Express, May 14, 2015, Subscribers: 22,738, Members: Companies: 14,345 , Users: 38,183 Reliability of Stacked Microvia Hardeep Heer, Ryan Wong; Firan Technology Group The Printed Circuit Board industry has seen a steady reduction in pitch
SMTnet Express, February 27, 2014, Subscribers: 22818, Members: Companies: 13775, Users: 35799 A Novel High Thermal Conductive Underfill For Flip Chip Appliation. Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Silicon dioxide
Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
SMTnet Express, December 28, 2017, Subscribers: 31,130, Companies: 10,829, Users: 24,226 Article Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack Shoudong Gu, Xiaoyang Jiao, Jianfang Liu *, Zhigang Yang, Hai
SMTnet Express, January 21, 2021, Subscribers: 27,785, Companies: 11,245, Users: 26,399 Reliability of Stacked Microvia Reliability of Microvia has been a concern since microvias were introduced to our industry. This study
