Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
Using JTAG Emulation for Board-Level Functional Test Using JTAG Emulation for Board-Level Functional Test Demanding Test Requirements for Processor Based Boards As chip packaging and interconnectivity have become more dense and operate