Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
SMTnet Express, July 15, 2021, Subscribers: 26,890, Companies: 11,401, Users: 26,748 Advanced Technologies for Industry — Product Watch Flexible and Printed Electronics Flexible electronics refers to a class of lightweight, flexible
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